MULTILAYER SEMICONDUCTOR DEVICE

摘要

Provided is a multilayer semiconductor device wherein thermal dispersion is improved and furthermore, heat dissipation efficiency is improved. In a multilayer semiconductor device (100), a plurality of semiconductor chips (20-1, 20-2) are laminated, and each semiconductor chip has at least one circuit region. The circuit region is arranged to disperse heat generated from the circuit region when the circuit region is driven. The multilayer semiconductor device (100) may be also provided with a heat dissipating section (50) for dissipating the heat generated from the circuit region, and the circuit regions may be arranged so that the circuit region having a higher heat generating quantity per unit area has a smaller heat resistance between the heat dissipating section.