| 摘要 |
PROBLEM TO BE SOLVED: To provide a process of dividing a laminated wafer having a plurality of laminated layers, the process enabling to cut a wafer without generating fragments (chipping). SOLUTION: A process includes making a plurality of sections along streets 201 formed like a grid on the surface, laminating a plurality of wafers 200 where a device 202 is formed on the sectioned regions, and dividing the laminated layer wafer 20 along the streets 201. Cutting is carried out using a cutting means which gives supersonic vibrations to a cutting blade 43 in a radial direction to cut a laminated wafer 20 supported on a chuck table 3. The laminated wafer 20 supported on the chuck table 3 is cut along the streets 201 while supersonic vibrations in a radial direction are given to the cutting blade 43 by supersonic providing means. COPYRIGHT: (C)2009,JPO&INPIT |
