发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a sputtering apparatus which can inhibit a rotatably installed cylindrical target from locally wearing in an end part thereof in a longitudinal direction, uniformize an erosion region, and consequently improve the use life thereof. SOLUTION: This sputtering apparatus includes: a pair of sputtering evaporation sources 2 which have the rotatable cylindrical targets 13, and magnetic-field-generating members 14 that are installed inside the cylindrical targets 13 and are placed along a longitudinal direction thereof; and a sputtering power source 3 which supplies an electric power for discharge to both of the respective cylindrical targets 13 of the pair of the sputter evaporation sources 2 as cathodes. The pair of the sputtering evaporation sources 2 and 2 have the respective cylindrical targets 13 which are placed in parallel so as to face to each other, and the respective magnetic-field-generating members 14 and 14 which generate a magnetic field that forms magnetic flux lines that pass through the surface of the cylindrical targets 13 and 13 and have a direction of pulling each other. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009024230(A) 申请公布日期 2009.02.05
申请号 JP20070189471 申请日期 2007.07.20
申请人 KOBE STEEL LTD 发明人 TAMAGAKI HIROSHI
分类号 C23C14/35 主分类号 C23C14/35
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