| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a plated film applicable even on the surface of a non-conductive material such as glass or a ceramic, in which a metal coating film having excellent adhesiveness is formed by a simple treatment process and the film thickness is easily increased. SOLUTION: The electrolytic copper plating method includes following (1)-(4) steps, that is, (1) a step for bringing a zinc oxide film forming composition comprising an aqueous solution containing zinc ion, nitrate ion and amine borane compound wherein the molar concentration of nitrate ion is 1-3 times of the molar concentration of zinc ion into contact with a material to be treated to form a zinc oxide film, (2) a step for applying a catalyst by being brought into contact with a catalyst imparting solution comprising an aqueous solution containing a catalytic metal and having pH≥3.5, (3) a step for forming an electroless plated film and (4) a step for forming the electrolytic copper plating film using an electrolytic copper plating solution comprising an aqueous solution containing copper acetate, a conductive salt and chloride ion. COPYRIGHT: (C)2009,JPO&INPIT
|
