| 摘要 |
The present invention relates to a method for forming vias in a substrate, comprising the following steps: (a) providing a substrate having a first surface and a second surface; (b) forming a photo resist layer on the first surface of the substrate; (c) forming a pattern on the photo resist layer; (d) forming a groove and a pillar in the substrate according to the pattern, wherein the groove surrounds the pillar; (e) forming a polymer in the groove of the substrate; (f) removing the pillar of the substrate to form an accommodating space; (g) forming a conductive metal in the accommodating space; and (h) removing part of the second surface of the substrate to expose the conductive metal and the polymer. As a result, thicker polymer can be formed in the groove, and the thickness of the polymer in the groove is uniform.
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