| 摘要 |
A wafer polishing device is provided to reduce tact time by prevent polishing processing time from extending according to time interval among the processing. A wafer polishing device comprises a turn table(10), a rough polishing part(30), a fine polishing part(50) a polishing part(60), a polishing table(61), a polisher(62) and a buffer polishing part(40). The rough polishing part includes a roughing table(31) absorbing the wafer and a roughing wheel(32) progressing a rough process in one side of turn-table. The fine polishing part includes a fine table absorbing the wafer and a fine wheel progressing a fine process in the rear of the rough table. |
