| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer level flip chip package for manufacturing a flip chip package by directly coating two layers of liquid anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) on a wafer. <P>SOLUTION: The method of manufacturing the flip chip package includes a step (a) of applying and drying a non-conductive mixed solution containing insulative polymer resin, a curing agent, and an organic solvent on the upper portion of a wafer with a non-solder formed bump thereon to form a non-conductive layer, a step (b) of applying and drying the conductive mixed solution containing insulative polymer resin, curing agent, organic solvent, and conductive particles on the upper portion of the non-conductive layer to form an anisotropic conductive layer, a step (c) of forming respective semiconductor chips by dicing the wafer formed with the non-conductive layer and the anisotropic conductive layer, and a step (d) of flip chip connecting the semiconductor chips by arranging the semiconductor chips on the electrode on a substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
