SEMICONDUCTOR CHIP INCLUDING UNIVERSAL WIRING LINE, SEMICONDUCTOR PACKAGE, CARD, AND SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip including universal wiring lines, a semiconductor package, a card, and a system.

SOLUTION: The semiconductor chip is provided with an integrated circuit part on a semiconductor substrate, one or more conductive pads disposed on the semiconductor substrate so as to be electrically connected to the integrated circuit part, and a plurality of universal wiring lines which are disposed on the semiconductor substrate apart from the one or more conductive pads and are electrically insulated from the integrated circuit part.

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