| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of detecting a wire disconnection defect of an external terminal to which a plurality of bonding wires are connected, without being influenced by dispersion of an electrical characteristic. <P>SOLUTION: In this semiconductor device 1, bonding pads P11, P12 are connected to an external terminal T1 through bonding wires W11, W12, and bonding pads P21, P22 are connected to an external terminal T2 through bonding wires W21, W22, and a PMOS transistor M1 is connected between the bonding pads P11, P21, and a PMOS transistor M2 is connected between the bonding pads P12, P22. Switches SW1, SW2 for controlling transmission/blocking of an output signal from an OP amplifier OP1 for controlling PMOS transistors M1, M2 are connected respectively to each gate electrode of the PMOS transistors M1, M2. <P>COPYRIGHT: (C)2009,JPO&INPIT |
