| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated semiconductor device for which a normal semiconductor element having an electrode terminal formed on its one face can be used, and which prevents the manufacturing process for the laminated semiconductor device from being complex. SOLUTION: The laminated semiconductor device 10 has a lamination of a plurality of semiconductor elements 12, and a metal wire 20, whose one end is connected to electrode terminals 18 of the semiconductor elements 12, is extended in contact with the side faces of the semiconductor elements 12, where the metal wire 20 is bonded to side face wires 22 that are formed of conductive paste containing conductive particles on the side faces of the semiconductor elements 12. COPYRIGHT: (C)2009,JPO&INPIT |
