| 摘要 |
PROBLEM TO BE SOLVED: To simply divide a wafer into individual semiconductor chips at a relatively low cost without corroding bonding pads while maintaining cleaning effects. SOLUTION: By focusing attention on the point that a corrosion rate of bonding pads due to cutting water obtained by mixing pure water with carbon dioxide is not so fast at the start of process but gradually becomes fast after a certain period of time, the cutting process of a wafer W using the cutting water is intercepted at every predetermined time, for example, every 15 seconds, and a cutting-water-removing process which removes the cutting water from the surface of a wafer by using air blasts from an air curtain 41 are performed repeatedly during an intercepted time, thereby suppressing the corrosion progress of the bonding pads while carrying out the cutting. COPYRIGHT: (C)2009,JPO&INPIT
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