发明名称 MANUFACTURING METHOD OF LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light emitting device capable of improving the light extracting efficiency of a sealed part. <P>SOLUTION: An annular diffusion preventing part 20 is formed on a wiring board 10 surrounding a light emitting element 30 on the wiring board 10 (step S1). The diffusion preventing part 20 is heated at a temperature or higher at which the diffusing preventing part 20 starts to be deformed (step S2). Next, a sealing material liquid or gel 40D is dropped from a discharging device 240 to cover the light emitting element 30 on the surface of a part surrounded by the diffusing preventing part 20 of the wiring board 10 (step S3). Next, the sealing material 40D is heated at a temperature or higher at which the viscosity of the sealing material 40D is lowered, a temperature at which the hardening reaction of the sealing material 40D starts, and a temperature lower than the temperature at which the diffusion preventing part 20 starts to be deformed (step S4). Subsequently, the sealing part 40 is formed in a shape of a dome by hardening the sealing material 40D by applying heat energy (step S5). <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026893(A) 申请公布日期 2009.02.05
申请号 JP20070187410 申请日期 2007.07.18
申请人 SONY CORP 发明人 HOSONO HIROYUKI;HIROSE TAKETO
分类号 H01L33/54;H01L33/56;H01L33/62 主分类号 H01L33/54
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