发明名称 SUBSTRATE PARTITION METHOD AND LASER IRRADIATION APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To form a reforming region long in a direction along a partition schedule line. <P>SOLUTION: The major axis direction of a pulse laser beam is adapted to be aligned to a partition schedule line direction of a quartz substrate W. Therefore, as compared to, for example, a method of aligning the minor axis direction of the pulse laser beam of an elliptic shape to the direction along the partition schedule line of the quartz substrate W, the irradiation region of the pulse laser beam can be more expanded in a direction along the partition schedule line and the reforming region longer in the direction along the partition schedule line can be formed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009023194(A) 申请公布日期 2009.02.05
申请号 JP20070187945 申请日期 2007.07.19
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA
分类号 B28D5/00;B23K26/073;B23K26/38;B23K26/40;C03B33/09 主分类号 B28D5/00
代理机构 代理人
主权项
地址