| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroplating apparatus capable of forming a uniform plating coat. SOLUTION: The electroplating apparatus 100 includes a cathode installation section 12 for loading a cathode 11, an anode installation section 14 for loading an anode 13, a plating bath 20 for accommodating a plating liquid 21, a flowing section 30 for flowing the plating liquid 21, and a pressure regulating section 40 for holding the inside of the plating bath 20 at a specified pressure. The pressure regulating section 40 holds the inside of the bath 20 at the pressure the same as the vapor pressure Pb of the plating liquid 21, or holds at or higher than the vapor pressure Pb but not higher than (vapor pressure Pb+15 kPa). The anode 13 is set at the upstream side, and the cathode 11, at the downstream side; or the anode 13 and the cathode 11 are arranged in parallel to the flow of the plating liquid 21, performing an electroplating treatment while flowing the plating liquid 21. COPYRIGHT: (C)2009,JPO&INPIT
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