| 摘要 |
PROBLEM TO BE SOLVED: To uniformize the polishing amount of each conductor layer in the width direction of TAB tape. SOLUTION: The chemical polishing device is provided with a plurality of jet vessels storing a chemical polishing a conductor layer in the width direction of TAB tape, and the plurality of jet vessels are each provided with: a chemical introduction port feeding a chemical into a jet vessel; a jet port jetting the chemical from the upper edge part of the jet vessel, so as to be brought into contact with the conductor layer of the TAB tape to be carried out; and a flow regulating plate provided within the jet vessel and also at the lower part of the jet port and controlling the jet speed of the chemical, respectively. COPYRIGHT: (C)2009,JPO&INPIT
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