| 摘要 |
PROBLEM TO BE SOLVED: To provide a guide rail which can increase a performance of transporting a thin leaf member, and to provide a device which is excellent in the transportation performance of the thin leaf member. SOLUTION: A semiconductor element mounting device includes horizontally- and parallelly-extended contact run/support members which are opposed to each other so as to support a transported thin leaf member at its both ends in a direction perpendicular to the transportation direction of the leaf member; and anti-falling restricting members extended toward the opposing other contact run/support members obliquely and downwards. The contact run/support member includes guide rails each of which has a contact part and a non-contact part for the thin leaf member, a ratio in the run direction length of all the non-contact parts to the contact and non-contact parts is between 30% and 80%. The contact run/support member also includes arranged along the guide rails and the leaf member transportation path for heating a resin on the thin leaf member, and a means for externally discharging a gas filled in the resin. COPYRIGHT: (C)2009,JPO&INPIT
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