发明名称 |
IN SITU DEPOSITION OF DIFFERENT METAL-CONTAINING FILMS USING CYCLOPENTADIENYL METAL PRECURSORS |
摘要 |
A method is disclosed depositing multiple layers of different materials in a sequential process within a deposition chamber. A substrate is provided in a deposition chamber. A plurality of cycles of a first atomic layer deposition (ALD) process is sequentially conducted to deposit a layer of a first material on the substrate in the deposition chamber. These first cycles include pulsing a cyclopentadienyl metal precursor. A plurality of cycles of a second ALD process is sequentially conducted to deposit a layer of a second material on the layer of the first material in the deposition chamber. The second material comprises a metal different from the metal in the cyclopentadienyl metal precursor.
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申请公布号 |
US2009035946(A1) |
申请公布日期 |
2009.02.05 |
申请号 |
US20080173374 |
申请日期 |
2008.07.15 |
申请人 |
ASM INTERNATIONAL N.V. |
发明人 |
PIERREUX DIETER;JONGBLOED BERT;ZAGWIJN PETER |
分类号 |
H01L21/31;C23C16/06 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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