| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the peeling of a resin part from a base material even when considerable loads are applied by a mounter or the like during mounting onto a mounting board in a light emitting device for which the resin part is formed on one side of the base material covering a light emitting element and a wire part. <P>SOLUTION: In an inverted chip type light emitting device, the area occupancy of electrode patterns 3a and 3b on the upper surface side and the back surface side in a prescribed range including the resin part 8 is increased such that the electrode patterns 3a and 3b on the upper surface side and the back surface side in the prescribed range including the resin part 8 are not bent even when the loads during mounting onto the mounting board are applied to the light emitting device, and the area occupancy of the electrode patterns 3a and 3b on the upper surface side and the back surface side right on the outside of the prescribed range including the resin part 8 is made smaller than the area occupancy of the electrode patterns 3a and 3b on the upper surface side and the back surface side in the prescribed range including the resin part 8. <P>COPYRIGHT: (C)2009,JPO&INPIT |
