发明名称 HEAT DISSIPATING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat dissipating component which is high in material yield, and can be freely formed in a variety of large and small shapes and can efficiently increase heat dissipation area, by using a plate material. <P>SOLUTION: The heat dissipating component has: at least one fin portion comprising a plurality of arrays of fins formed by making cuts in a predetermined shape in one plate material and raising cut portions; and connecting portions, the portions of the plate material, which connect the fins. The predetermined shape in which the cuts are made consists of two sides of adjacent hook shapes and/or three sides of adjacent U-shapes, and the plurality of arrays of fins formed by raising cut portions are in a nearly L shape. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026784(A) 申请公布日期 2009.02.05
申请号 JP20070185278 申请日期 2007.07.17
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 HIRASAWA MASASHI;UCHIMURA YASUHIRO;YAMAMOTO MASAAKI
分类号 H01L23/36;H01L33/64;H05K7/20 主分类号 H01L23/36
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