AIRTIGHT PACKAGE, AND METHOD OF MANUFACTURING AIRTIGHT PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide: an airtight package providing performance improved by preventing oxygen molecules caused upon anodic bonding from diffusing into a storage chamber and by keeping the inside of the storage chamber in a prescribed decompressed atmosphere or a prescribed gas atmosphere; a method of manufacturing the airtight package; and an electronic device with the airtight package. SOLUTION: The airtight package is equipped with: a lid substrate composed of glass containing an alkali metal; a semiconductor substrate having a frame formed in a frame shape; and the storage chamber surrounded by the lid substrate and the frame and held in an airtight state, wherein: a reservoir chamber is provided so as to surround the storage chamber; and a partition wall is provided which is connected to the lid substrate and the semiconductor substrate to partition the storage chamber and the reservoir chamber. COPYRIGHT: (C)2009,JPO&INPIT