发明名称 ELECTRONIC COMPONENT AND ITS ASSEMBLING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which reduces thermal resistance generated between the electronic component and an external heat radiating material, and is excellent in heat radiating property. SOLUTION: The electronic component 1 includes a main body 2 having a lead terminal 3, and a metal radiating terminal 4 integrally, and the external heat radiating material 6 is fixed to the heat radiating terminal 4. The heat radiating terminal 4 and the external heat radiating terminal 6 are soldered by which the uneven surface of the heat radiating terminal 4 is filled with solder, the thermal resistance generated between the heat radiating terminal 4 and the external heat radiating material 6 can be reduced, and the heat radiating property of the electronic component 1 can be secured. Moreover, an energization property between the heat radiating terminal 4 and the external heat radiating material 6 is also improved. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009027043(A) 申请公布日期 2009.02.05
申请号 JP20070190142 申请日期 2007.07.20
申请人 TDK-LAMBDA CORP 发明人 OSABE TOSHIYUKI;ONISHI MASAHIDE
分类号 H01L23/40;H05K7/06;H05K7/20 主分类号 H01L23/40
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