| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate-holding/rotating mechanism, and a substrate treatment device provided with the substrate-holding/rotating mechanism, capable of holding a substrate without contacting the main surface of the substrate, using a simple structure. SOLUTION: A substrate holding/rotating member 2 includes a disk-shaped spin base 7. A plurality of fixing/support members 10a-10f are fixed and are arranged on a circumferential edge part of an upper surface of the spin base 7, at a substantially equal angle interval. The lower part of a circumferential end surface of a wafer W is in point-contact with the fixing/supporting members 10a-10f, and the wafer W is held by the substrate-holding/rotating member 2. When the spin base 7 is rotated, the atmosphere between the upper surface of the spin base 7 and the lower surface of the wafer W is discharged to the outside the spin base 7 by centrifugal force and is depressurized, and the space below the wafer W becomes a negative pressure space. The wafer W is pulled to the spin base 7 side, and the lower part of the circumferential end surface of the wafer W is pressed against the fixing/supporting members 10a-10f. COPYRIGHT: (C)2009,JPO&INPIT
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