发明名称 ELECTROMAGNETIC ULTRASONIC MEASURING DEVICE, AND MEASURING METHOD OF PLATE THICKNESS AND STRESS USING ELECTROMAGNETIC ULTRASONIC WAVE
摘要 PROBLEM TO BE SOLVED: To provide an electromagnetic ultrasonic measuring device capable of measuring a material thickness and a stress inexpensively in a short time. SOLUTION: An ultrasonic wave is generated on the surface of a measuring object plate. In this case, sound velocity of a transversal wave or a longitudinal wave is assumed (S11). The waveform of a received resonance spectrum is calculated (S12), and, first of all, the plate thickness is calculated (S13). Then, the sound velocity is calculated based on the plate thickness (S14). Acoustic double refraction B or a sound velocity ratio R is determined based on the calculated sound velocity. The stress is calculated based on the determined acoustic double refraction B or sound velocity ratio R (S15). Thereafter, the determined plate thickness and stress are displayed on a display part (S16). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009025093(A) 申请公布日期 2009.02.05
申请号 JP20070187143 申请日期 2007.07.18
申请人 NICHIZOU TEC:KK 发明人 MITANI KINYA;NAKAYAMA YOSHIHARU
分类号 G01B17/02;G01L1/00 主分类号 G01B17/02
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