| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pellicle frame that causes less harm to mask flatness even when a pellicle is stuck after a mask is finished. <P>SOLUTION: The pellicle frame uses a material having 100 GPa or more of Young's modulus of the pellicle frame in the pellicle used on a semiconductor lithography. In addition, in the pellicle used in the semiconductor lithography, the flatness of the pellicle frame is≤15μm. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
