发明名称 |
POST CMP SCRUBBING OF SUBSTRATES |
摘要 |
A cleaning method is provided for brush cleaning a surface of a substrate. The method comprises scrubbing a first surface of the substrate with a brush having a first surface geometry; and then scrubbing the first surface of the substrate with a brush having a second surface geometry, wherein the first and the second surface geometries are different. Numerous other aspects are provided.
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申请公布号 |
US2009031512(A1) |
申请公布日期 |
2009.02.05 |
申请号 |
US20080249927 |
申请日期 |
2008.10.11 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
SIN GARRETT H.;KO TERRY KIN-TING;HUEY SIDNEY P. |
分类号 |
B08B1/02;B08B1/04;B08B3/02;B08B3/04;H01L21/00 |
主分类号 |
B08B1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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