发明名称 A COMPOUND BAMBOO SECTION MATERIAL AND A PROCESS METHOD THEREOF
摘要 A compound bamboo section material and a process method thereof, which includes at least two section material layers and an adhesive layer (2) in between bonded reciprocally. Dispersive adhesive-guide holes (9,11,104) are formed on bamboo green layer or bamboo yellow layer which is the bond surface of bamboo. The depth of the adhesive-guide holes reaches to the fibre layer (402) of bamboo, the adhesive layer (2) permeates into the holes to form a solid embedded adhesive layer. The process method includes the following steps: selecting arc bamboo with a bamboo green layer and a bamboo yellow layer, forming a slot on the direction of the bamboo axis, and heating to soften bamboo; subsequent flattening softened arc bamboo into a sheet, during flattening, forming dispersive crack-guide holes (105,404) along the bamboo yellow surface of arc bamboo at the same time; forming adhesive-guide holes (9,11,104) on the surface of flattened bamboo and the depth of the holes reaches to the fibre layer of bamboo; applying glue on the bond surface to form the adhesive layer (2); and assembling another bonded section material and then forming the compound bamboo section material. The compound bamboo section material has the advantages of raised utilizing rate of bamboo material, greatly raised itself strength of bamboo and adhesive strength.
申请公布号 WO2009015599(A1) 申请公布日期 2009.02.05
申请号 WO2008CN71795 申请日期 2008.07.29
申请人 WU, YONGWEI 发明人 WU, YONGWEI
分类号 B27D1/04 主分类号 B27D1/04
代理机构 代理人
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