| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having high sensitivity, a method of producing a cured relief pattern using the composition, and a semiconductor device having the cured relief pattern. <P>SOLUTION: The positive photosensitive resin composition comprises (A) 100 parts by mass of a polymer which is an alkali-soluble phenolic resin, polyhydroxystyrene or polyhydroxystyrene derivative, (B) 1-100 parts by mass of a photoacid generator, and (C) 0.01-70 parts by mass of a terpene compound. <P>COPYRIGHT: (C)2009,JPO&INPIT |
