| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosemiconductor encapsulating agent which is excellent in heat resistance, light resistances and adhesion to a housing material, etc., and forms a cured product having a high refractive index as well as excellent transparency, and a photosemiconductor device obtained using the same. <P>SOLUTION: The photosemiconductor encapsulating agent comprises a silicone resin having an aliphatic hydrocarbon group or its fluorinated compound group and a cyclic ether-containing group within a molecule, and a heat curing agent which reacts with the cyclic ether-containing group. When the photosemiconductor encapsulating agent is formed into a cured product of 2 mm thickness, the cured product has a light transmittance at 400 nm wavelength of ≥90% and a refractive index of ≥1.4. <P>COPYRIGHT: (C)2009,JPO&INPIT |
