发明名称 FILM CAPACITOR AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To improve reliability of a connection state between a bonding portion of a terminal plate and a metallized contact terminal portion without using solder. SOLUTION: A first film capacitor 10A has a winding body 16 constituted by winding a film where an electrode pattern is formed, a capacitor element 12 having a first terminal portion 18 and a second terminal portion 20 provided at both ends of the winding body 16 respectively, and a first terminal plate 14A and a second terminal plate 14B bonded to the first terminal portion 18 and second terminal portion 20 of the capacitor element 12. The first terminal plate 14A has four first joint portions 22 welded to the first terminal portion 18 and a first support portion 24 provided in common to the four first joint portions 22 and supporting the first joint portion 22, where the first support portion 24 is 1.0 to 1.2 mm thick and the first joint portions 22 are 0.2 to 0.4 mm thick. Second joint portions 26 and a second support portion 28 of the second terminal plate 14B are the same. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026928(A) 申请公布日期 2009.02.05
申请号 JP20070188063 申请日期 2007.07.19
申请人 SOSHIN ELECTRIC CO LTD 发明人 MAEDA JUNJIRO;TATEYAMA KENICHI;TSURUTA YUKIHIRO
分类号 H01G4/18;H01G4/228;H01G4/32 主分类号 H01G4/18
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