| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact piezoelectric oscillator, and further to provide a piezoelectric oscillator having a temperature compensation function excellent in followup ability. SOLUTION: This piezoelectric oscillator is composed at least of: a piezoelectric vibrating chip 35 in which an exciting electrode 46 is formed; a package bottom part 31 for housing the piezoelectric vibrating chip 35 therein; and a cover body 39 bonded with the package bottom part 31 for air-tightly sealing the piezoelectric vibrating chip 35. Wherein, the package bottom part 31 and the cover body 39 are constituted of semiconductor substrates, circuit patterns 32, 40 are formed on surfaces of the package bottom part 31 and the cover body 39 by a semiconductor integrated circuit process and further, a temperature detection section 43 is disposed at a position closest to the exciting electrode 46 in the piezoelectric vibrating chip 35. COPYRIGHT: (C)2009,JPO&INPIT
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