| 摘要 |
A substrate for fixing an integrated circuit element includes: a plurality of metal columns that are aligned in a longitudinal direction and a lateral direction in a planar view, each of the plurality of metal columns having a first face and a second face facing opposite direction to the first face; and a connecting part that connects the plurality of metal columns one another at a part of each of the plurality of metal columns between the first face and the second face. In the substrate, a recognition mark is formed on the first face of one of the plurality of metal columns.
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