| 摘要 |
<p>This invention provides a heat curable composition for a protective film which, even when light sources different from each other in spectral characteristics of an exposure light source are used, causes no significant lowering in sensitivity, can form a protective layer with high sensitivity, is free from coloration upon hard baking, and has good light transmittance in a visible light region. The heat curable composition for a protective film comprises (A) an alkali soluble resin, (B) a compound containing two or more ethylenically unsaturated group, and (C) a photopolymerization initiator. The light transmittance of the heat curable composition for a protective film at a wavelength of 400 nm is not less than 90% per mum of the layer thickness. The component (C) has an absorption maximum wavelength at 310 to 370 nm.</p> |
