发明名称 MOUNTING DEVICE FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting device capable of mounting a plurality of TABs without driving holding units holding the TABs. <P>SOLUTION: The mounting device comprises a tape sticking means 11 for sticking an adhesive tape 27 on the TAB 2 and a mounting means for mounting the TAB on which the adhesive tape is stuck by the tape sticking means on the substrate. The mounting means comprises: a plurality of holding units 57 each having a guide groove 58 formed at predetermined intervals in a peripheral direction of an index table 56 to vertically penetrate the holding unit, and also sucking/holding the TAB having the adhesive tape stuck on its lower end surface; a driving means 60 for driving the index table in a horizontal direction, a vertical direction, and a rotating direction to position the TABs sucked/held by the plurality of holding units at mounting positions of a side portion of the substrate one after another; and a movable member 59 provided above a holding unit positioned at the mounting position of the substrate by the driving means and driven in a lowering direction to press and mount the TAB held by the holding unit on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026831(A) 申请公布日期 2009.02.05
申请号 JP20070186240 申请日期 2007.07.17
申请人 SHIBAURA MECHATRONICS CORP 发明人 MORI HARUO;HIROSE YOSHITAKE;IKEDA KAZUHITO;OKAZAWA MITSUHIRO
分类号 H01L21/60 主分类号 H01L21/60
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