| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a solder-plated wire for a solar cell, which reduces the warpage of an Si cell even in a thermal contraction after being soldered to the Si cell and has a high conductivity. <P>SOLUTION: With respect to the solder-plated wire for a solar cell, which has solder plating coated on a surface of a conductor 10 worked into a straight-angled shape so that the wire should be joined to the solar cell, the conductor 10 has a volume resistivity of≤30μΩmm and has double layered structure consisting of a surface layer 11 and an inner layer 12, where a crystal grain size of the surface layer 11 is made larger than that of the inner layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
