发明名称 STRUCTURALLY ISOLATED THERMAL INTERFACE
摘要 <p>In one embodiment, an assembly having bodies of different thermal expansion rates comprises a first body, a second body having a different thermal expansion rate than the first body, and a plurality of high conductivity members attached to both the first and second bodies. The high conductivity members are more flexible than the first and second bodies in order to allow for varied thermal expansion of the first and second bodies. The assembly may comprise a solar collector assembly, wherein the first body is a solar cell attached to a substrate, and the second body is a heat sink.</p>
申请公布号 WO2009017906(A1) 申请公布日期 2009.02.05
申请号 WO2008US68043 申请日期 2008.06.24
申请人 THE BOEING COMPANY;GRIP, ROBERT;RAWDON, BLAINE;JALEWALIA, GURPREET 发明人 GRIP, ROBERT;RAWDON, BLAINE;JALEWALIA, GURPREET
分类号 B32B15/20;H01L31/042 主分类号 B32B15/20
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