| 摘要 |
It is an object of the invention to provide a component bonding method and a component laminating method that can improve productivity in the heat pressing process. Provided is a component bonding method of bonding a semiconductor component (13) having a thermosetting adhesive layer (13a) formed on a lower surface thereof to a circuit board (5) having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface (5a) of the circuit board (5), the semiconductor component (13) is held by a component holding nozzle (12) having a heater, the adhesive layer (13c) is contacted to the surface-modified resin layer, and the adhesive layer (13c) is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer (13c) and the resin surface (5a) is improved, and thus the component holding nozzle (12) can be separated from the semiconductor component (13) without wait for completely hardening the adhesive layer (13c). Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding. |
