| 摘要 |
<p>PROBLEM TO BE SOLVED: To allow a light-emitting element and a light-receiving element to be as thin as possible, with a module and set incorporating them to be smaller as well. SOLUTION: A semiconductor chip 21 is provided as a light-emitting element and light-receiving element, and a resin-sealing body which seals them is of a material which becomes transmissive to light. A recessed part is formed on a region where a light is emitted from an element and on a region where a light comes in an element, constituting a reflective surface there. As a result, a light is allowed to enter/exit through a side surface. A metal reflective plate 30 is formed at the device to improve light emission/reception efficiency.</p> |
