| 摘要 |
The present invention provides a system, apparatus and method for supplying liquid through a dispensing loop to tools requiring such liquid. In particular, the present invention provides a system, apparatus and method for supplying liquid or slurry to CMP (chemical mechanical polishing) tools of a semiconductor manufacturing process. In accordance with the present invention, the liquid is delivered at a consistent flow rate and pressure to the tools, by controlling the flow rate and pressure through the use of pumps combined with flow or pressure sensors in the dispense loop.
|
