METHOD FOR MARKING WAFER, METHOD FOR MARKING FAILED DIE, METHOD FOR ALIGNING WAFER AND WAFER TEST EQUIPMENT

摘要

A method for marking a wafer, a method for marking a failed die, a method for arranging the wafer, and a method for testing the wafer are provided to control a mark size of the failed die and to implement a permanent marking or failed die marking. A wafer(200) includes at least two reference marks(204). A plurality of dies(202) are equipped in one surface of the wafer. The wafer is arranged by testing the reference marks on the wafer at the same time. A marking process for the wafer is performed by using a laser beam. The position of the wafer is not changed when performing the marking process by using the laser beam.