THERMAL-EMITTING MEMORY MODULE, THERMAL-EMITTING MODULE SOCKET ELECTRICALLY CONNECTING THE THERMAL-EMITTING MEMORY MODULE, COMPUTER SYSTEM COMPRISING THE THERMAL-EMITTING MEMORY MODULE AND THE THERMAL-EMITTING MEMORY MODULE, AND METHOD OF USING THE COMPUTER SYSTEM COMPRISING THE SAME

摘要

A thermal-emitting memory module, a thermal-emitting module socket electrically connecting the thermal-emitting memory module, a computer system comprising the thermal-emitting memory module and the thermal-emitting memory module, and a method of using the computer system comprising the same are provided to lengthen the life span of the computer system by rapidly cooling down the temperature of the computer system. A heat dissipation memory module(3) comprises a module PCB(10), semiconductor devices(13,16,19) and a heat dissipation part(20). The module PCB includes the circuit wiring. The semiconductor device is arranged on the circuit wiring. The heat dissipation part is positioned at the neighboring of the semiconductor device. A heat dissipation module socket(62) is electrically connected with the heat dissipation memory module and comprises a socket body(70). The flow reservoir is exposed through fluid flux gate(74,76). A computer system(133) comprises the heat dissipation memory module and the heat dissipation module socket. The heat dissipation memory module and the heat dissipation module socket is electrically connected.