发明名称 |
Biochip package and biochip packaging substrate |
摘要 |
A biochip package allowing biochips optimized for high-volume production to be compatible with general-purpose devices and a biochip packaging substrate of the biochip package are provided. The biochip package includes a biochip (200) having a probe array mounted thereon and a biochip packaging substrate (100) on which the biochip is mounted and which has a through cavity (115) exposing a rear surface of the biochip. |
申请公布号 |
GB2451565(A) |
申请公布日期 |
2009.02.04 |
申请号 |
GB20080013645 |
申请日期 |
2008.07.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNE-YOUNG LEE;DONG-HO LEE |
分类号 |
C40B60/00;C12Q1/68;C40B99/00 |
主分类号 |
C40B60/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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