发明名称 Biochip package and biochip packaging substrate
摘要 A biochip package allowing biochips optimized for high-volume production to be compatible with general-purpose devices and a biochip packaging substrate of the biochip package are provided. The biochip package includes a biochip (200) having a probe array mounted thereon and a biochip packaging substrate (100) on which the biochip is mounted and which has a through cavity (115) exposing a rear surface of the biochip.
申请公布号 GB2451565(A) 申请公布日期 2009.02.04
申请号 GB20080013645 申请日期 2008.07.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNE-YOUNG LEE;DONG-HO LEE
分类号 C40B60/00;C12Q1/68;C40B99/00 主分类号 C40B60/00
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