| 摘要 |
A semiconductor device, a pre-mold package, and a manufacturing method thereof are provided to prevent a diaphragm from being attached to a plate or a substrate while improving sensitivity. A mold resin(6) has a box shape composed of the bottom and a side wall for reclaiming a lead frame(5). At least one semiconductor chip is mounted on the bottom of the mold resin. A cover is attached to an upper side of the side wall of the mold cover. The lead frame includes a shielding plate reclaimed in the bottom of the mold resin, a plurality of arms(13,14) extended from the shielding plate, and a plurality of external terminals connected to the shielding plate or the semiconductor chip, and is partially exposed on the backplane of the bottom of the mold resin. The cover is made of conductive material and is electrically connected to the end(13a,14a) of the arm exposed on the upper part of the side wall of the mold resin. |
