发明名称 MOLD FILM COMPOSITION FOR FORMING PATTERN AND MOLD FILM COMPOSITION MANUFACTURED BY USING THE SAME
摘要 A mold film composition for forming a pattern, and a mold film prepared by using the composition are provided to improve heat resistance and the enhance the uniformity of pattern formed on a substrate even in case of the exposure of UV rays. A mold film composition for forming a pattern comprises 30-70 wt% of at least two kinds of reactive oligomers selected from a polyester-based reactive oligomer, a silicone-based reactive oligomer, an acrylic reactive oligomer, and an epoxy acrylate-based reactive oligomer; 30-70 wt% of a monofunctional or multifunctional monomer having at least one unsaturated group in a molecule; and 1-10 parts by weight of a photoinitiator.
申请公布号 KR20090012823(A) 申请公布日期 2009.02.04
申请号 KR20070076984 申请日期 2007.07.31
申请人 SHINWHA INTERTEK CORP. 发明人 CHOI, SEUNG KYU;AHN, CHEOL HEUNG;KIM, SUK JUN;YEOUN, JE MIN;CHOI, YOUNG SHIN;PARK, CHAN KYU;SON, KA YOUNG;YANG, HYUN EE
分类号 G03F7/028 主分类号 G03F7/028
代理机构 代理人
主权项
地址