发明名称 |
MOLD FILM COMPOSITION FOR FORMING PATTERN AND MOLD FILM COMPOSITION MANUFACTURED BY USING THE SAME |
摘要 |
A mold film composition for forming a pattern, and a mold film prepared by using the composition are provided to improve heat resistance and the enhance the uniformity of pattern formed on a substrate even in case of the exposure of UV rays. A mold film composition for forming a pattern comprises 30-70 wt% of at least two kinds of reactive oligomers selected from a polyester-based reactive oligomer, a silicone-based reactive oligomer, an acrylic reactive oligomer, and an epoxy acrylate-based reactive oligomer; 30-70 wt% of a monofunctional or multifunctional monomer having at least one unsaturated group in a molecule; and 1-10 parts by weight of a photoinitiator.
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申请公布号 |
KR20090012823(A) |
申请公布日期 |
2009.02.04 |
申请号 |
KR20070076984 |
申请日期 |
2007.07.31 |
申请人 |
SHINWHA INTERTEK CORP. |
发明人 |
CHOI, SEUNG KYU;AHN, CHEOL HEUNG;KIM, SUK JUN;YEOUN, JE MIN;CHOI, YOUNG SHIN;PARK, CHAN KYU;SON, KA YOUNG;YANG, HYUN EE |
分类号 |
G03F7/028 |
主分类号 |
G03F7/028 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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