发明名称 Photosensitive insulating paste and thick-film multi-layer circuit substrate
摘要 <p>A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO2, B2O3 and K2O such that the compositional proportions by weight of the three components represented by (SiO2, B2O3, K2O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof A thick-film multi-layer circuit substrate including the paste is also disclosed.</p>
申请公布号 EP1326137(B1) 申请公布日期 2009.02.04
申请号 EP20030000874 申请日期 2000.01.19
申请人 MURATA MANUFACTURING CO., LTD. 发明人 TOSE, MAKOTO;KAWAKAMI, HIROMICHI;WATANABE, SHIZUHARU;IHA, MICHIAKI
分类号 G03F7/004;H05K3/46;C03C8/14;C03C8/16;H01B3/08;H05K1/03;H05K3/00 主分类号 G03F7/004
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