发明名称 |
Die loss estimation using universal in-line metric (UILM) |
摘要 |
A system predicts die loss for a semiconductor wafer by using a method referred to as universal in-line metric (UILM). A wafer inspection tool detects defects on the wafer and identifies the defects by various defect types. The UILM method applies to various ways of classification of the defect types and takes into account the impact of each defect type on the die loss.
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申请公布号 |
US7485548(B2) |
申请公布日期 |
2009.02.03 |
申请号 |
US20060276719 |
申请日期 |
2006.03.10 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
DESHMUKH PURNIMA;SIMMONS STEVEN J. |
分类号 |
H01L29/417;H01L29/36;H01L31/00;H01L31/06 |
主分类号 |
H01L29/417 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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