| 摘要 |
(Object) To provide a new electronic parts cleaning solution that inhibits the corrosion of silicon or metals other than the silicon, and that efficiently cleans off fine dust or organic matters adhered on the surface of electronic parts, and that does not have white turbidity easily. (Solution) An electronic parts clearing solution which is characterized in containing an anionic surfactant, hydroxide, metal corrosion inhibitor, water, and a nonionic surfactant represented by formula (I) and/or a nonionic surfactant represented by formula (II): <?in-line-formulae description="In-line Formulae" end="lead"?>HO-((EO)x-(PO)y)z-H (I)<?in-line-formulae description="In-line Formulae" end="tail"?> <?in-line-formulae description="In-line Formulae" end="lead"?>R-[((EO)a-(PO)b)c-H]m (II)<?in-line-formulae description="In-line Formulae" end="tail"?> (EO is an oxyethylene group, and PO is an oxypropylene group. x and y, and a and b are positive number, which x(x+y) and a(a+b) are 0.05 to 0.5 respectively, and z and c are positive integers. R is a residue group wherein hydrogen atoms are removed from hydroxyl group of alcohol or amine represented by a group having valency of 1~4).
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