| 摘要 |
<p>A substrate processing apparatus is provided to exhaust the proper amount according to the amount of the air current generated by the rotation of the processed substrate by controlling the number of rotation of the multiblade centrifugal fan. The spin chuck(40) supports the wafer (W). The spin chuck is rotated in the motor(41). The resist nozzle(42) supplies the resist liquid to the wafer. The treatment vessel(43) accommodates the spin chuck. The exhaust means(44) is disposed at the bottom of the treatment vessel. The multiblade centrifugal fan(50) is arranged in the periphery side of the treatment vessel. The controller(60) is connected to the drive power(51a) of the multiblade centrifugal fan and the motor.</p> |
