发明名称 FILM FORMATION METHOD, APPARATUS FOR SEMICONDUCTOR PROCESS AND COMPUTER READABLE MEDIUM
摘要 A film formation method, apparatus for semiconductor process and computer readable medium are provided to consecutively perform the deposition of the Si system inorganic film while maintaining vacuum. The wafer boat having a plurality of semiconductor wafers is mounted is loaded within the process vessel(step 1). In the state rotating the wafer boat, the film forming process of the amorphous carbon film is performed for the first time(step 2). The purge gas from the fuzzy gas supply source is introduced within the process vessel(step 3). In maintaining the decompression state, the Si based inorganic film is successively formed by the switching of the gas into the in-situ process(step 4).
申请公布号 KR20090012113(A) 申请公布日期 2009.02.02
申请号 KR20080071966 申请日期 2008.07.24
申请人 TOKYO ELECTRON LIMITED 发明人 OKADA MITSUHIRO;KUBO KAZUMI
分类号 H01L21/205 主分类号 H01L21/205
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