发明名称 CHEMICAL AMPLIFICATION TYPE POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 A chemically amplified positive photoresist composition, and a method for forming a resist pattern by using the composition are provided to improve resolution and coating property. A chemically amplified positive photoresist composition comprises a resin mixture comprising the repeating units represented by the formula 1 and the formula 2; a photoacid generator; and an organic solvent, wherein R1 and R2 are independently H, a C1-C10 linear or branched alkyl group or a C3-C10 cycloalkyl group; R3 is a C1-C10 linear or branched alkyl group or a C3-C10 cycloalkyl group; a1, a2, b and c are independently a number of 0-1; a1+a2+b+c=1; 0.30<=[(b+c)/(a1+a2+b+c)]<=0.34; and 0.01<=[c/(a1+a2+b+c)]<=0.2.
申请公布号 KR20090011664(A) 申请公布日期 2009.02.02
申请号 KR20070075483 申请日期 2007.07.27
申请人 DONGWOO FINE-CHEM CO., LTD. 发明人 KIM, SUNG HOON;PARK, HAN WOO
分类号 G03F7/039 主分类号 G03F7/039
代理机构 代理人
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