| 摘要 |
PURPOSE: A method for forming a bump on a semiconductor wafer and a semiconductor wafer having a bump formed thereby are provided to form the bump on the semiconductor wafer without lowering the stability of bump forming solution. CONSTITUTION: A passivation layer(22) is formed on the remaining part except for the center part of an electrode pad(21) of a semiconductor wafer(20). A bump forming solution(23A) for forming a bump is uniformly coated on the surface of the electrode pad(21). The bump is formed on the surface of the electrode pad(21) by heating the bump forming solution. The remaining bump forming solution except for the bump is removed from the semiconductor wafer(20). |
